Go to KYOCERA HOME Singapore THE NEW VALUE FRONTIER
Home      News      Products      About   
Semiconductor IC Package
Application Examples
Sales Offices
Products >  Semiconductor IC Package >  Application examples 

Application Examples

 
<Click a photo to enlarge>  
   
Ceramic COB Ceramic COB Substrate for Compact Camera Module (CCM)
   
Filter/Balun Filter/Balun Embedded LTCC Substrate for RF Modules (Bluetooth® / Wireless LAN / TV Tuner Module etc.)
   
Ceramic Package for MEMS Ceramic Package for MEMS (Gyroscope / Accelerometer etc.)
   
Cu Heat-Slug Alumina Package for High Brightness LED Cu Heat-Slug Alumina Package for High Brightness LED
   
Thin Film AlN/Alumina Thin Film AlN / Alumina Substrate for High Brightness LED
   
   
Anti-Wiggle Receptacle for TOSA/ROSA Anti-Wiggle Receptacle for Transmitter Optical Sub-Assembly (TOSA) and Receiver Optical Sub-Assembly (ROSA)
   
LC Stubless Receptacle for TOSA/ROSA LC Stubless Receptacle for Transmitter Optical Sub-Assembly (TOSA)
   
Substrate for Flip Chip LSI Build Up Substrate for Flip Chip LSI
   
The Bluetooth® word mark and logos are owned by the Bluetooth SIG, Inc. and any use of such marks by KYOCERA Corporation is under license. Other trademarks and trade names are those of their respective owners.
Inquiries by E-Mail
  Product Information
Semiconductor IC Package (JAPAN)
Semiconductor IC Package (USA)
KYOCERA SLC Products
   
 
Top of page
Products >  Semiconductor IC Package >  Application examples 
Contact      Terms of use      Privacy      Sitemap     
Copyright, KYOCERA Corporation. All rights reserved.